Beijing Technol Science Co., Ltd.  

Product Name: PVD Magnetron Sputtering System RF & DC Sputtering Deposition System for Laboratory Model NO.: JCP350 Type: Magnetron Sputtering Application: School, Lab Certification: ISO Material: Stainless Steel Structure: Cylinder Customized: Customized Trademark: Technol Transport Package: Export Wooden Box Specification: Customize Origin: China HS Code: 8486202200 Product Description Features:*JCP350 High vacuum magnetron sputtering system adopts single gun independently, multiple gun in turns and combined centripetal co-sputtering working modes; Each sputtering gun and substrate holder are equipped with independent shutters to ensure the coating processability (pre-sputtering, multi-layerfilm, doped film, prevention of cross-contamination and interference, etc.) The substrate holder can be negatively biased to clean and activate the substrate and assist the sputtering function.*Mainly used to develop nano-scale single-layer and multi-layer metal conductive film (optional strong magnetic target plating magnetic material film), semiconductor film, and ceramic insulating thin film and so on.*The design is integrated with the mainframe and the PLC touch screen control, easy operation and control; With compact structure and small footprint. Thisequipment is widely used by colleges & universities, research institutes of teaching and scientific research experiment; Enterprises develop new thin film materials and small batch production and so on, deeply praised by the majority of users.Technical Parameters:Equipment Name: Magnetron Sputtering SystemModel: JCP350Chamber Structure: Vertical top cover structure, rear pumping system, automaticpneumatic open typeChamber Size: Φ350×H350mmBaking Temperature: Room temperature to 500ºCSputtering Path: UpwardRotating Substrate Holder: Φ120mmFilm Thickness Nonuniformity: Within the scope of Φ75mm≤±5.0%Sputtering Target/Evaporation Electrode: 2 Pcs of Φ2 Inches magnetron targets, reserved 1 pc of target positionProcess Gas: 2-3 Routes gas flow controlControl Method: PLC Control/IPC automatic control(optional)Occupied Area: (Mainframe) L1600×W800×H1700mmPower: ≥10kWOptional: Air cooled chiller, air compressor